位置栏目

程林  特任教授
主要研究方向:电源管理及模拟集成电路设计,包括无线充电芯片、高速直流-直流转换器、汽车电子芯片和脑电/生物电信号检测模拟前端芯片等
电话:
邮箱:eecheng@ustc.edu.cn
办公室:北区融合楼209室
个人简介

现任中国科学技术大学国家示范性微电子学院特任教授、博士生导师、副院长,国家青年特聘专家。主要研究方向为功率及模拟集成电路设计, 包括高压/高速直流-直流转换器、无线充电芯片、汽车电子芯片、电生理信号模拟前端芯片等。主持或参与国家自然科学基金面上项目、科技部重点研发计划、中科院战略性先导项目和企业攻关项目等10余项。在国际会议和期刊上发表论文40多篇,其中以第一或通讯作者发表集成电路设计领域顶级会议ISSCC和顶级期刊JSSC论文共12篇。以第一发明人获得美国专利授权 2 项,中国专利授权 7 项。目前担任ISSCC国际技术委员会电源管理分委会委员、IEEE ICTA 2023技术委员会联合主席(Co-chair)。

个人经历
  • 2004-2008 合肥工业大学,学士,电子科学与技术

  • 2008-2011 复旦大学,硕士,微电子与固体电子学

  • 2011-2016 香港科技大学,博士,电子及计算机工程

  • 2016-2018 香港科技大学,博士后

荣誉
  • 2022年IEEE ICTA最佳论文奖

  • 2020年IEEE ASP-DAC最佳设计奖

  • 2015年IEEE固态电路学会博士成就奖

  • 2018年香港科学会青年科学家提名奖

论文

· J. Jin, Y. Zhou, C. Chen, X. Han, W. Xu and L. Cheng*,   A 98.6%-Peak-Efficiency 1.47A/mm2-Current-Density Buck-Boost Converter with Always Reduced Conduction Loss IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 448-450, Feb. 2023.

· J. Yuan, Z. Liu, F. Wu and L. Cheng*, A 12V/24V-to-1V DSD Power Converter with 56mV Droop and 0.9µs 1% Settling Time for a 3A/20ns Load Transient, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 300-301, Feb. 2022. (Invited to the special issue of JSSC)

· D. Pan, G. Li, F. Miao, W. Sun, X. Gong, L. Zhang and L. Cheng*, A 1.2W 51%-Peak-Efficiency Isolated DC-DC Converter with a Cross-Coupled Shoot-Through-Free Class-D Oscillator Meeting the CISPR-32 Class-B EMI Standard, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 240-241, Feb. 2022.

· D. Pan, G. Li, F. Miao, B. Deng, J. Wei, D. Yu, M. Liu, and L. Cheng*, A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 468-469, Feb. 2021. (First ISSCC paper from USTC)

· L. Cheng*, W. H. Ki, A 30MHz hybrid buck converter with 36mV droop and 125ns 1% settling time for 1.25A/2ns load transient, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 188-189, Feb. 2017.

· L. Cheng*, W. H. Ki, Y. T. Wong, T. S. Yim and C. Y. Tsui, A 6.78MHz 6W wireless power receiver with a 3-Level 1×/½×/0× reconfigurable resonant regulating rectifier, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 376-377, Jan. 2016.

· L. Cheng*, Y. Liu, W. H. Ki, A 10/30MHz wide-duty-cycle-range buck converter with DDA-based Type-III compensator and fast reference-tracking responses for DVS applications, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 84-85, Feb. 2014. (Invited to the special issue of JSSC)

· Z. Liu, J. Yuan, F. Wu, L. Cheng*, A 12V/24V-to-1V PWM-controlled DSD converter with delay-insensitive and dual-phase charging techniques for fast transient responses IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 12, pp. 3853-3864, Dec. 2022. (Invited paper)

· L. Cheng*, X. Ge, W. C. Ng, W. H. Ki, J. Zheng, T. F. Kwok, C. Y. Tsui, M. Liu, A 6.78-MHz single-stage wireless charger with constant-current constant-voltage charging technique, IEEE Journal of Solid-State Circuits (JSSC), vol. 55, no. 4, pp. 999-1010, Apr. 2020. (Invited paper, first ISSCC paper from USTC)

· L. Cheng*, W. H. Ki, C. Y. Tsui, A 6.78-MHz single-stage wireless power receiver using a 3-mode reconfigurable resonant regulating rectifier, IEEE Journal of Solid-State Circuits (JSSC), vol. 52, no. 5, pp. 1412-1423, May 2017.

· L. Cheng*, W. H. Ki, Y. Lu and T. S. Yim, Adaptive on/off delay-compensated active rectifiers for wireless power transfer systems, IEEE Journal of Solid-State Circuits (JSSC), vol. 51, no. 3, pp. 712-723, Mar. 2016.

· L. Cheng*, Y. Liu, W. H. Ki, A 10/30 MHz fast reference-tracking buck converter with DDA-based Type-III compensator, IEEE Journal of Solid-State Circuits (JSSC), vol. 49, no. 12, pp. 2788-2799, Dec. 2014. (Invited paper)