人工智能赋能集成电路设计自动化（EDA），聚焦于集成电路后端物理设计、三维芯片可靠性设计、神经形态计算系统设计的应用基础研究。主持国家自然科学基金专项项目1项，国家自然科学基金青年项目1项，作为项目骨干参与了科技部重点研发计划等项目的研究工作。在EDA领域国际知名期刊和会议上发表论文总计40余篇。

2020.11-至今，中国科学技术大学，微电子学院，特任副研究员

2018.07-2020.10，合肥工业大学，电子科学与应用物理学院，讲师

2017.09-2017.11，香港中文大学，计算机科学与工程学系，访问学者

2012.09-2018.06，中国科学技术大学，电子科学与技术系，硕士、博士

2018年获得中国科学技术大学优秀博士学位论文奖

1. Qi Xu, Lijie Wang, Jing Wang, Lin Cheng, Song Chen, Yi Kang, “Graph Attention-Based Symmetry Constraint Extraction for Analog Circuits”, IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 71, no. 8, pp. 3754-3763, 2024.

2. Bo Yang, Qi Xu*, Hao Geng, Song Chen, Bei Yu, Yi Kang, “Floorplanning with Edge-Aware Graph Attention Network and Hindsight Experience Replay”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 29, no. 3, pp. 56:1-56:17, 2024.

3. Yongtian Bi, Qi Xu*, Hao Geng, Song Chen, Yi Kang, “AD2VNCS: Adversarial Defense and Device Variation-Tolerance in Memristive Crossbar-Based Neuromorphic Computing Systems”, ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 29, no. 1, pp. 8:1-8:19, 2023.

4. Yongtian Bi, Qi Xu*, Hao Geng, Song Chen, Yi Kang, “Resist: Robust Network Training for Memristive Crossbar-Based Neuromorphic Computing Systems”, IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), vol. 70, no. 6, pp. 2221-2225, 2023.

5. Qi Xu, Junpeng Wang, Bo Yuan, Qi Sun, Song Chen, Bei Yu, Yi Kang, Feng Wu, “Reliability-Driven Memristive Crossbar Design in Neuromorphic Computing Systems”, IEEE Transactions on Automation Science and Engineering (TASE), vol. 20, no. 1, pp. 74-87, 2023.

6. Qi Xu, Hao Geng, Tianming Ni, Song Chen, Bei Yu, Yi Kang, Xiaoqing Wen, “Fortune: A New Fault- Tolerance TSV Configuration in Router-based Redundancy Structure”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3182-3187, 2022.

7. Qi Xu, Hao Geng, Song Chen, Bo Yuan, Cheng Zhuo, Yi Kang, Xiaoqing Wen, “GoodFloorplan: Graph Convolutional Network and Reinforcement Learning Based Floorplanning”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 10, pp. 3492-3502, 2022.

8. Qi Xu, Wenhao Sun, Song Chen, Yi Kang, Xiaoqing Wen, “Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 5, pp. 1196-1208, 2022.

9. Song Chen*, Qi Xu*, Bei Yu, “Adaptive 3D-IC TSV Fault Tolerance Structure Generation”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 38, no. 5, pp. 949-960, 2019.

10. Qi Xu, Song Chen, Xiaodong Xu, Bei Yu, “Clustered Fault Tolerance TSV Planning for 3D Integrated Circuits”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 36, no. 8, pp. 1287-1300, 2017.